Additively Manufactured RF Systems: From Materials to Millimeter-Wave and Beyond
Nano Dimension Technology Demo
April 24 from 3:30 – 5 pm
Join us for a tech demo of the DragonFly IV system — the industry’s premier platform for additive manufacturing of electronics. Explore how its advanced multi-material inkjet technology enables rapid prototyping and on-demand production of complex, multilayer electronic components — all in-house and within hours. From digital file upload to fully printed, functional circuits, see how the DragonFly IV accelerates innovation, streamlines development, and transforms the way electronics are designed and manufactured across industries.
22 April 2025
This collaborative workshop brings together leading experts from academia and industry to explore the transformative role of Additively Manufactured Electronics (AME) in high-frequency RF system design. This session in collaboration with Nano Dimension, showcases cutting-edge research and development in multi-material 3D printed RF components across millimeter-wave, sub-terahertz, and reconfigurable intelligent surface (RIS) domains.
The session will begin with Nano Dimension providing an overview of their AME ecosystem, including materials, design rules, printing technologies, and Flight Hub software. Following this, researchers from the University of Technology Sydney (UTS) will present recent breakthroughs in the design and additive manufacturing of millimetre-wave and terahertz (THz) RF components. Their work focuses on metasurface-enabled antennas, wideband transmitarrays, and high-gain beamformers utilizing hybrid dielectric–metallic deposition techniques.
Next, Northeastern University will highlight progress in integrating additive manufacturing with microelectromechanical systems (MEMS) for the development of sensors and integrated intelligent systems. Additive microelectromechanical systems, integrated directly into the electronic boards, will enhance the miniaturization of intelligent integrated systems . North Dakota State University (NDSU) will present recent advancements in AME-based dual-band metasurface antennas, high-gain reflectarrays, miniaturized temperature sensors, and RFID-based environmental sensors—showcasing the potential of multi-material 3D printing to realize complex RF systems for 5G, IoT, and smart sensing applications.
The University of Nevada–Reno will discuss an innovative AME-based millimeter-wave power harvesting and radar project, featuring antenna and rectifier system design for W-band applications. Finally, Georgia Tech will introduce the concept of micromodular electronics—an AME-enabled approach to creating compact, ultralow-power microsystems using microchiplets and adaptive interconnection strategies, opening new pathways in medicine, robotics, and intelligent devices.
This workshop emphasizes the synergy between additive manufacturing, RF system design, and emerging application needs—paving the way for scalable, reconfigurable, and energy-efficient platforms in next-generation wireless technologies